nine_inch_nerd schreef op 6 juni 2024 15:24:
Door aan het spitten en zie dit:
Intel Clearwater Forest CPU is Next Major Hybrid Bonding Launch- First Intel CPU product using hybrid bonding to stack CPU core chiplets atop base tiles with SRAM and I/O functions
- Attaches up to 12 CPU chiplets to functional base tile
- 3D stacking “improves the latency between compute and memory by shortening the hops, while at the same time enabling a larger cache” - Pushkar Ranade, Intel
Lijkt nieuw.